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Key Challenges and Issues Facing The IC Advanced Packaging Industry Report, 2007
NEW YORK --(Business Wire)-- Reportlinker.com announces that a new market research report related to the Packaging industry is available in its catalogue.
IC Advanced Packaging Industry Report, 2007
To order that report:
www.reportlinker.com/p074617/IC-Advanced-Packaging-Industry- Report-2007.html
For more information, contact Nicolas by email nbo@reportlinker.com , by phone +33 4 37 65 17 03.
The prices of semiconductor are fluctuating now and then because of continual advent of new products and the shortened lifecycle. In view of the cost of a complete semiconductor product, expense on packaging accounts for 5 to 25 percentage of market price of one semiconductor unit. However, as technology advances, the proportion of packaging cost to the whole cost becomes higher. Therefore, most clients of international semiconductor venders care more about the quality of packaging, output and terms of delivery. The packaging technology becomes so complicated and so many packaging methods available that add trouble to one single international semiconductor company of IDM to meet the increasing market demand. As a result, outsourced packaging becomes the mainstream.
In the outsourced packaging and test market, large international IDM companies shift their attention to core advantages such as design, R&D and marketing when facing fierce competition results from the rapid updating of products. Meanwhile, large international IDM companies become far less profitable under the influence of universal recession in the industry. Therefore, they sharply decrease their capital expense on semiconductor produce capacity and are rather conservative in extending produce capacity of backend packaging. Meanwhile world class package foundries continually invest in new technology R&D as advanced package demands are brought about by new IC products. As a result, large international IDM companies are more dependent upon advanced packaging technology of package and test foundries. As international IDM companies speed up outsourced processing worldwide, CAGR would reach 168% between 2003 and 2009.
Outsourced packaging e.g. BGA, CSP, FC, QFN and SiP are all fairly advanced. To enter the field, large investment (at least one billion yuan) is needed to purchase equipment and conduct technological R&D. Without enough capital and strong technological R&D capability, it is quite impossible to enter this field. So only big enterprises may go somewhere and only a few may have a place in package. As a result, supply never meets demand in package market. Therefore, advanced package companies get a higher gross profit margin. Gross profit margins of most companies have an increment from about 6% in 2001 to 20-35% at present. Naturally their revenues also increased by a large margin. Such case may only happen to advanced package industry in electronic industry.
Taiwan is gradually becoming a power in the packaging and test fields. Among the global top ten packaging and test companies, six are from Taiwan, all of which are performing well in both revenues and profits. If ranking by profit scale, nine Taiwan package and test companies may be listed in top-ten. So it can be concluded that global advanced packaging and test companies inhabit in Taiwan. However, Japanese often do well in the IC substrate field, so close business relationship between Taiwan and Japan is built as Japan companies transfer their technologies to Taiwan when an inadequate production capacity takes place. Actually 95% of electronic technologies in Taiwan, including packaging but not limited to, are from Japan.
With simultaneous complete master of both global advanced IC wafer foundry and IC advanced packaging technologies, Taiwan achieves best performance in the semiconductor industry worldwide and has become the heart of global semiconductor industry.
Taiwan' large packaging and test companies often merge and purchase small ones when developing. On average each company merges or acquires at least three small companies. For instance ChipMos Technology Ltd has acquired seven in five years. Or incorporate virtual group is formed such as Mosel Vitelic Inc, most of its member company deal with packaging & test. With their own know-how, they compete nice and well in the market. Many rank No. 1 in their respective fields and are very competitive. Sound in capital market and excellent in integrating, Taiwan companies are quite successful in merge and acquisition, which contributes a lot in the overall success of Taiwan packaging and test industry.
1 Overview of Global PCB and Packaging Industry
1.1 Global PCB Industry
1.2 Global Packaging and Test Market
1.3 Global Key Packaging and Test Manufacturers
1.4 Taiwan's Packaging and Test Industry
2 Overview of IC Substrate Packaging Market
2.1 IC Substrate Packaging Market
2.2 Downstream Product Market of IC Substrate Packaging
2.3 LCD Drive IC Packaging Market
3 Brief Introduction of Advanced Packaging
3.1 History of IC Substrate Packaging
3.2 BGA Packaging
3.2.1 Concept of BGA
3.2.2 Advantages and Process of BGA Packaging
3.2.3 Brief Introduction of PBGA
3.2.4 Brief Introduction of CBGA
3.2.5 TBGA
3.3 CSP Packaging
3.3.1 Definition of GSP Packaging
3.3.2 Brief Introduction of WL-CSP
3.3.3 Application of WL-CSP
3.3.4 Process of WL-CSP
3.4 FC packaging
3.4.1 Concept of FC Packaging
3.4.2 Process of FC Packaging
3.5 QFN Packaging
3.6 SiP Packaging
4 Advanced Packaging Material Industry and Market
4.1 Golden Thread
4.2 IC Substrate
5 Advanced Packaging Manufacturers
5.1 ASE (Advanced Semiconductor Engineering Inc.)
5.2 Amkor
5.3 SPIL (Siliconware Precision Industries Co., Ltd)
5.4 STATS ChipPAC
5.5 PPT (Phoenix Precision Technology Corporation)
5.6 Nan Ya PCB
5.7 Kinsus (Kinsus Interconnect Technology Corp.)
5.8 PTI (Power Technology Inc.)
5.9 ChipMos (ChipMos Technology Ltd)
5.10 King Yuan Electronics Co., Ltd
5.11 Chipbond Technology Corporation
5.12 International Semiconductor Technology, Ltd
5.13 UTAC
5.14 CARSEM
5.15 Ibiden
5.16 Shinko
5.17 Jiangyin Changdian Advanced Packaging Co., Ltd (JCAP)
5.18 Global Advanced Packaging Technology Limited (GAPT)
5.19 Unimicron
Proportion of Global PCB Production Value by Technology Types, 2007
Production Value of Global PCB by Regions, 2007
Market Scale of Specific Packaging and Test Industries, 2005-2011
Proportion of Outsourced Packaging, 2005-2011
Proportion and Estimated Proportion of Various Packaging Forms, 2003-2008
Ranking of the World's Top 13 Packaging Companies, 2007
Statistics and Forecast of Global IC Substrate Market Scale, 2005-2009
Global IC Substrate Product Classification, 2006
Growth Margin of Output Value of FC, PBGA and CSP, 2004-2007
FC Supply and Demand in the World, 2005-2008
Technology Distribution of Main PC Manufacturers, 2007
Forecast of Embedded Package Structure, 2010
Forecast of Shipment and Average Price of DRAM Memory, 2006Q1-2007Q4
Forecast of Balance of Supply and Demand of DRAM Memory, 2006Q1-2007Q4
Market Share of Self-owned Brands of Top Ten Global Manufacturers, 2007Q3
Market Share of Main Manufacturers of Large TFT-LCD Drive IC, 2006
Global TFT-LCD Supply and Demand, 2000-2012
Lead Pitch Contrast between Different Packaging
Contrast of the Biggest Lead Number
Frequency Upper Limit of Different Packaging
Section of BGA
Sketch Map of BGA Packaging
Process of BGA Packaging
Typical Diagram of BGA Packaging Process
Sketch Map of PBGA
Sketch Map of CBGA
Sketch Map of the Structure
Sketch Map of nanoBGA
Contrast between TSOP and CSP
Sketch Map of Stack Memory CSP
Sketch Map of Standard WL-CSP
Sketch Map of Fujitsu WL-CSP
Sketch Map of Amkor WL-CSP
Suitable Types for WL-CSP
Application Proportion of WL-CSP Downstream in 2007
Production Process of WL-CSP
Operation Process of WL-CSP
Sketch Map of CMOS Sensor Packaging
Sketch Map of FC
FC Examples
Comparison of FC&BGA
Typical FC Packaging Process
Process of daylight & moonlight FC Packaging
Experiments on FC Packaging
Sketch Map of QFN Packaging
SiP Packaging Examples (802.11b IFE Module)
SiP Cross Section
Typical FC SiP Cross Section
SiP Classification according to Stack Forms
SiP Production Process
Example of Philips RF SiP
Passive Device Substrate Technology
Circuit Diagram of SiP Integrated Passive Device
PSvfBGA Section
PSvfBGA Planform
MCM-PBGA Sketch Map
Global Market Shares for Golden Thread for IC Packaging, 2006
Global Market Shares for Solder Ball Materials for IC Packaging, 2006
Statistics and Forecast of Revenues and Gross Profit Margin of ASE, 2001-2008
Market Value of ASE, 2002-2006
Organization Structure of ASE
Revenues and Gross Margin of ASE, 2006Q1-2007Q3
EBITDA and Capex of ASE, 2006Q1-2007Q3
Revenues and Gross Margin of ASE's Packaging Sector, 2006Q1-2007Q3
Revenue Structure of ASE by Packaging Type, 2006Q1-2007Q3
Revenue Structure of ASE by Test Type, 2006Q1-2007Q3
Core Technology of ASE
Core Testing Technology of ASE
Revenues of Amkor, 1985-2005
Revenues and Gross Margin of Amkor, 2006Q1-2007Q3
Revenue, Capex and Key Investment Areas of Amkor, 2006Q1-2007Q3
Proportion of Amkor Products Used in Downstream Industries, 2007Q3
Total Investment of SPIL
Organization Structure of SPIL
Revenues and Gross Margin of SPIL, 2001-2006
Revenue Structure of SPIL by Region
Proportion of SPIL Products Used in Downstream Products
Proportion of SPIL Products by Technology, 2005Q4, 2006Q1, 2007Q2, 2007Q3
Revenues and Gross Margin of STATS ChipPAC, 2004-2006
Figure: Revenue Structure of STATS ChipPAC by Product, 2006
Proportion of STATS ChipPAC Products Used in Downstream Products, 2006
Revenue Structure of STATS ChipPAC by Region, 2006
Global Network of STATS ChipPAC
Statistics and Forecast of PPT Revenues, 1998-2009
Product Structure of PPT, 2005Q1-2007Q3
Proportion of Number of Layers of PPT Products, 2005Q1-2007Q3
Proportion of PPT Products Used in Downstream Products, 2005Q1-2007Q3
Figure: Revenue Structure of PTT by Region, 2005Q1-2007Q3
Statistics of PPT Capital and Employees
Revenue and Gross Profit Rate of Kinsus, 2001-2006
Operation Profit Rate of Kinsus, Nan Ya PCB and PPT, 2003Q1-2008Q4
Contribution Rates of Main Clients of Kinsus Revenue, 2006
Contribution Rates of Main Clients of Kinsus Revenue, 2007H1
Revenue and Gross Profit Rate of PTI, 2005-2008
Revenue and Gross Profit of ChipMos, 2001-2007Q3
EBITDA Profit of ChipMos, 2005Q1-2007Q3
Revenue Structure of ChipMos, 2007Q3
Revenue Structure of ChipMos by Product, 2007Q3
Core Technology of ChipMos
Main Clients of Memory of Chipmos
Revenue of Chipmos of Memory, 2001-2007Q3
Revenue of Chipmos of NAND Flash, 2006Q1-2007Q3
Main Clients of LCD Drive IC of ChipMos
Revenue of LCD Drive IC of ChipMos, 2001-2007Q3
Output Capacity of Shanghai Base of ChipMos
Statistics and Forecast of KYEC's Revenues and Gross Profit Margin, 2002-2007
Organization Structure
Structure of Revenue from Process Business, 3Q2007
Revenue Structure by Product, 3Q2007
Structure of KYEC's Products Application in the Downstream Industry, 3Q2007
Chipbond's Client Structure, 2006
Chipbond's Revenue Structure by Product, 3Q2007
Chipbonds' Testing Business Structure, 2007Q1-Q3
Chipbond's Capacity Expansion, 1Q2007-4Q2008
Statistics and Forecast of IST's Revenue and Gross Profit Margin, 2003-2008
Capital Expenditure of IST, Chipmos and Chipbond, 2002-2007
IST's Production Capacity Expansion Scheme
UTAC's Revenue and Gross Profit Margin, 2001-2005
Overview of UTAC and NSEB
Clients of UTAC and NSEB
UTAC's Revenue Structure, 1Q2006
UTAC's Revenue Structure by Region, 1Q2006
IBIDEN's Financial Data, 2003-2007
IBIDEN's Capital Expenditure Scheme, FY2006 and FY2007
Statistics and Forecast of Shinko's Sales Revenue, FY2003-FY2007
Statistics and Forecast of Shinko's Net Returns on Sales, FY2003-FY2007
Shinko's Products
Statistics and Forecast of JCAP's Revenue and Gross Profit Margin, 2006-2009
JCAP's Monthly FBP Output, Jan-Nov 2007
Unimicron's Organizational Structure
Application Structure of Unimicron's Downstream Products, 1Q2006-2Q2007
Structure of Unimicron's Products by Technology Type, 1Q2007-4Q2008
Production Capacity of Unimicron by Product, 2005Q4-2006H2
Investment of Unimicron in Plants, 2000-2005
Ranking of 95 PCB Companies Worldwide, 2005 & 2006
Ranking of the World's Top Ten Packaging Companies, 2005
Clients of Main Global PC Substrate Manufacturers, 2005-2006
Output Capability of Main Global PC Substrate Manufacturers, 2007-2008
Global FC Demand Analysis (Converting into 31mm*31mm Substrates)
Rank of Self-owned Brands of Top Ten Global Manufacturers by Memory Operation Revenue, 2007Q3
Differences between conventional IC and WL-CSP
SiP Technological Circuit Diagram 2004-2018
etCSPSection
Global Market Scale of Advanced Packaging Material Industry, 2004-2008
ASE's Production Bases in Mainland China
Statistics of SPIL Production Capacity
SPIL's Major Raw Materials Suppliers
Merger Events of ChipMos
Structure of Revenue from Process Business, 1Q2006-2Q2007
IST's Production Capacity, 1Q2006-4Q2007
Product Groups Assembled at M Site
Product Groups Assembled at S Site
BGA/PGA Packaging
CSP Packaging
Statistics and Forecast of Unimicron's Mobile Phone PCB Shipment, 2002-2007
Unimicron's Manufacturing Sites
To order that report:
www.reportlinker.com/p074617/IC-Advanced-Packaging-Industry- Report-2007.html
(Long URLs in this release may need to be copied/pasted into your Internet browser's address field. Remove the extra space if one exists.)
For more information, contact Nicolas by email nbo@reportlinker.com , or by phone +33 4 37 65 17 03.
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