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Innovation by STMicroelectronics Boosts High-Speed Wi-Fi Performance in Mobiles, Tablets and PCs
(Thomson Reuters ONE Via Acquire Media NewsEdge)
Miniature dual-band IC, produced using ST's innovative Integrated Passive Device
technology, saves space and enhances power efficiency for longer battery life
Geneva, December 19, 2012 - STMicroelectronics (NYSE: STM), a global
semiconductor leader serving customers across the spectrum of electronics
applications, has revealed a new chip for faster wireless networking with
smartphones, tablets and other connected devices. The innovation enables
designers to save space and power consumption allowing more features and longer
battery life.
ST's new DIP2450 diplexer is used to connect a Wi-Fi IC to a single antenna
hence simplifying circuitry and saving pc-board space. It can also connect a
Bluetooth IC to the same antenna. Leveraging ST's Integrated Passive Device
(IPD) process technology, the DIP2450 has extremely small dimensions of only
1.1 x 1.25 mm and passes signals efficiently enabling high-speed communications
and low power consumption.
The DIP2450 supports the latest high-speed dual-band Wi-Fi standard (IEEE
802.11n), permitting multi-channel communications in the 5GHz band, in addition
to the established 2.4GHz operation. This allows extra user capacity as well as
higher data rates per user. Handsets with IEEE 802.11n have achieved speeds of
more than 60 Mbps, which is higher than the world's best average broadband
Internet connection speeds of around 50 Mbps recorded in countries such as South
Korea, Hong Kong and Japan.
ST's DIP2450 diplexer has already been validated for use with ST-Ericsson's
CW1260 dual-band Wi-Fi system-on-chip for multi-radio mobile applications. The
CW1260 will also use two other ST IPD products, a 5GHz band pass filter and a
matched balun (a signal-transforming device). The complete solution lowers power
consumption for extended battery life, saves pc-board space, and reduces
component count.
ST has a range of IPD components for RF applications, which deliver advantages
such as competitive cost structure, a small form factor, and reduced power
losses in systems such as Wi-Fi, Bluetooth(®), ZigBee(®), WiMax and 3G LTE. The
product range comprises diplexers, filters, baluns, RF couplers, triplexers, and
impedance-matching devices.
"The new diplexer, with its outstanding characteristics for high-speed Wi-Fi
applications, demonstrates our edge in delivering high-performing RF front-end
components with the highest integration, smallest footprint, and best
combination of power consumption and size," said Eric Paris, ASD&IPAD Product
Marketing Director, STMicroelectronics.
Major features of DIP2450-01D3:
* Footprint less than 1.4mm(2)
* Low profile (less than 600µm after reflow)
* Typical insertion loss 0.6dB (2.4GHz and 5GHz)
* High attenuation
* High rejection of out-of-band frequencies
* IPD integration enabling stable and repeatable RF front-end characteristics
The DIP2450-01D3 is in mass production now in the 1.1 x 1.25 mm 4-bump wafer-
level chip-scale package (WLCSP), priced from $0.12 for orders over 1,000
pieces.
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2011, the Company's net revenues were $9.73 billion. Further information on
ST can be found at www.st.com.
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz@st.com
ST WLAN Diplexer_IMAGE:
http://hugin.info/152740/R/1666260/540755.jpg
ST WLAN Diplexer:
http://hugin.info/152740/R/1666260/540754.pdf
This announcement is distributed by Thomson Reuters on behalf of
Thomson Reuters clients. The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and
other applicable laws; and
(ii) they are solely responsible for the content, accuracy and
originality of the information contained therein.
Source: STMicroelectronics via Thomson Reuters ONE
[HUG#1666260]
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