DSP Group's VoIP Platform Powers Cetis Next Generation IP Phones
(GlobeNewswire Via Acquire Media NewsEdge) LAS VEGAS, Jan. 2, 2013 (GLOBE NEWSWIRE) -- DSP Group® (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that its VoIP chipset solution has been selected to power the next generation of advanced IP telephones offered by Cetis Group, the world's leading manufacturer of hotel guestroom telephones under three world-class telephone brands: TeleMatrix, Teledex and Scitec.
Ideally suited for developing multiple innovative VoIP end points, DSP Group's highly-integrated XciteR™ VoIP chipset is powered by an ARM926™ application processor running Linux OS, together with a powerful DSP processor. XciteR provides the market's best price performance, as well as a myriad of embedded software features, including HD voice, multi-line, multi-party conferencing and mobility support through DECT/CAT-iq handsets and headsets.
"Our choice of DSP Group's XciteR platform was aided by their market leadership, their cost-effective, highly integrated System On a Chip, and their excellent customer support," said Dr. Bing Sun, CEO of Cetis. "Close collaboration with top-tier technology providers like DSP Group enables Cetis to constantly improve Total Cost of Ownership for our customers, while continuing to produce the most reliable, full-featured VoIP phones in the industry," he concluded.
"We are delighted to have partnered with Cetis Group, a recognized leader in hospitality telephony, to bring cost effective VoIP phones to this market, and speed migration from legacy analog to IP communication," said Fredy Rabih, Vice President VoIP Product Line Management at DSP Group. "This venture is another indication of our commitment to the IP phone market, as we continue to develop next generation technologies that raise the bar in functionality, features and value," he concluded.
About DSP Group
DSP Group®, Inc. (Nasdaq:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, DECT ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.
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About Cetis Group
Cetis, Inc. (www.CetisGroup.com), pronounced Setis, is a leading ISO-9001, RoHS, and WEEE-certified manufacturer of Scitec®, Teledex®, and TeleMatrix® brand telephones and ExpressNet® and AirLink® high-speed wireless broadband access solutions. Designed and engineered in America and Europe, Cetis E Series, I Series (formerly Teledex iPhone), Opal Series, Diamond Series, Nugget Series, 9600 Series, 3300 Series, and Aegis Series telephones, and ExpressNet, and AirLink high-speed Internet devices, are preferred by all major hotel brands globally. Cetis maintains sales and support facilities in North America, Beijing, Dubai, Mumbai, Singapore, and United Kingdom.
CONTACT: DSP Group Contact:
DSP Group, Inc.
Source: DSP Group, Inc.
2013 GlobeNewswire, Inc.
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